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Preparation and conductive mechanism of copper nanoparticles ink
Yang, Wendong, Liu, Chunyan, Zhang, Zhiying, Liu, Yun, Nie, ShidongVolume:
24
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-013-1541-3
Date:
December, 2013
File:
PDF, 892 KB
english, 2013