Solidification and interfacial interactions in gold–tin system during eutectic or thermo-compression bonding for 200
Garnier, Arnaud, Baillin, Xavier, Hodaj, FiqiriVolume:
24
Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-013-1515-5
Date:
December, 2013
File:
PDF, 1.57 MB
english, 2013