![](/img/cover-not-exists.png)
The effect of thiourea,l(−) cysteine and glycine additives on the mechanisms and kinetics of copper electrodeposition
Tadesse, Bogale, Horne, Michael, Addai-Mensah, JonasVolume:
43
Language:
english
Journal:
Journal of Applied Electrochemistry
DOI:
10.1007/s10800-013-0596-4
Date:
December, 2013
File:
PDF, 884 KB
english, 2013