Laser printing of conformal and multi-level 3D interconnects
Kim, H., Duocastella, M., Charipar, K. M., Auyeung, R. C. Y., Piqué, A.Volume:
113
Language:
english
Journal:
Applied Physics A
DOI:
10.1007/s00339-013-7909-7
Date:
October, 2013
File:
PDF, 457 KB
english, 2013