[IEEE 2007 International Microsystems, Packaging, Assembly...

  • Main
  • [IEEE 2007 International Microsystems,...

[IEEE 2007 International Microsystems, Packaging, Assembly and Circuits Technology - Taipei, Taiwan (2007.10.1-2007.10.3)] 2007 International Microsystems, Packaging, Assembly and Circuits Technology - High sensitivity silicon-based condenser microphone design

Chiung-I Lee,, Hsin-Tang Chien,, Ping-Ting Liu,, Jien Ming Chen,
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Year:
2007
Language:
english
DOI:
10.1109/IMPACT.2007.4433564
File:
PDF, 395 KB
english, 2007
Conversion to is in progress
Conversion to is failed