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[IEEE International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Irvine, California, USA (March 16-18, 2005)] Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Weld clip design for minimization of weldinginduced-alignment-distortion in butterfly laser module packages
Yaomin Lin,, Shi, F.G.Year:
2005
Language:
english
DOI:
10.1109/ISAPM.2005.1432036
File:
PDF, 1.87 MB
english, 2005