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Prediction of thermo-mechanical fatigue for solder joints in power electronics modules under passive temperature cycling
Sun, Z., Benabou, L., Dahoo, P.R.Volume:
107
Language:
english
Journal:
Engineering Fracture Mechanics
DOI:
10.1016/j.engfracmech.2013.05.009
Date:
July, 2013
File:
PDF, 1.16 MB
english, 2013