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Modeling and Experimental Study of the Kink Formation Process in Wire Bonding
Wang, Fuliang, Chen, Yun, Han, LeiVolume:
27
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2012.2225649
Date:
February, 2014
File:
PDF, 1.34 MB
english, 2014