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Formation of Cu-Sn Alloy Layer by Contact Deposition Using Quaternary Ammonium-Imide-Type Ionic Liquid
Katase, Takuma, Kurosaki, Ryoichi, Murase, Kuniaki, Hirato, Tetsuji, Awakura, YasuhiroVolume:
9
Year:
2006
Language:
english
Journal:
Electrochemical and Solid-State Letters
DOI:
10.1149/1.2171814
File:
PDF, 680 KB
english, 2006