[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China...

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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Localized induction heating for wafer level packaging

Chen, Mingxiang, Liu, Wenming, Xi, Yanyan, Lin, Changyong, Liu, Sheng
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Year:
2009
Language:
english
DOI:
10.1109/ICEPT.2009.5270760
File:
PDF, 1.32 MB
english, 2009
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