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[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - Selective induction heating for wafer level bonding and packaging
Chen, Mingxiang, Liu, Wenming, Xi, Yanyan, Lin, Changyong, Wong, C. P., Liu, ShengYear:
2009
Language:
english
DOI:
10.1109/ECTC.2009.5074253
File:
PDF, 1.55 MB
english, 2009