[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 2 — Effect on System-Level Performance
Fernandes, John Edward, Ghalambor, Saeed, Eiland, Richard, Agonafer, Dereje, Mulay, VeerendraYear:
2013
Language:
english
DOI:
10.1115/IPACK2013-73107
File:
PDF, 1.59 MB
english, 2013