[ASME ASME 2013 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems - Burlingame, California, USA (Tuesday 16 July 2013)] Volume 2: Thermal Management; Data Centers and Energy Efficient Electronic Systems - Improving the Thermal Performance of a Forced Convection Air Cooled Solution: Part 1 — Modification of Heat Sink Assembly
Ghalambor, Saeed, Fernandes, John Edward, Agonafer, Dereje, Mulay, VeerendraYear:
2013
Language:
english
DOI:
10.1115/IPACK2013-73108
File:
PDF, 1.51 MB
english, 2013