[IEEE 2013 IEEE Conference on Electrical Insulation and Dielectric Phenomena - (CEIDP 2013) - Chenzhen, China (2013.10.20-2013.10.23)] 2013 Annual Report Conference on Electrical Insulation and Dielectric Phenomena - Modelling the thermal conductivity of epoxy nanocomposites with low filler concentrations

The file will be sent to your email address. It may take up to 1-5 minutes before you receive it.

The file will be sent to you via the Telegram messenger. It may take up to 1-5 minutes before you receive it.

Note: Make sure you have linked your account to Z-Library Telegram bot.

The file will be sent to your Kindle account. It may take up to 1–5 minutes before you receive it.

Please note: you need to verify every book you want to send to your Kindle. Check your mailbox for the verification email from Amazon Kindle.