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[IEEE High Density Packaging (ICEPT-HDP) - Beijing, China (2009.08.10-2009.08.13)] 2009 International Conference on Electronic Packaging Technology & High Density Packaging - Wetting behavior of electrolyte in fine pitch Cu/Sn bumping process by electroplating
Jiang, Jin, Bi, Jinglin, Chen, Zhuo, Li, Ming, Mao, Dali, Suga, TadatomoYear:
2009
Language:
english
DOI:
10.1109/icept.2009.5270628
File:
PDF, 2.84 MB
english, 2009