Reflow profile study of the Sn‐Ag‐Cu solder

Soldering & Surface Mount Technology 2004 / 04 Vol. 16; Iss. 1

Reflow profile study of the Sn‐Ag‐Cu solder

Salam, B., Virseda, C., Da, H., Ekere, N.N., Durairaj, R.
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Volume:
16
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910410517022
Date:
April, 2004
File:
PDF, 1.36 MB
english, 2004
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