![](/img/cover-not-exists.png)
Reflow profile study of the Sn‐Ag‐Cu solder
Salam, B., Virseda, C., Da, H., Ekere, N.N., Durairaj, R.Volume:
16
Language:
english
Journal:
Soldering & Surface Mount Technology
DOI:
10.1108/09540910410517022
Date:
April, 2004
File:
PDF, 1.36 MB
english, 2004