Plasma enhanced atomic layer deposition of copper: A...

Surface and Coatings Technology 2013 / 09 Vol. 230

Plasma enhanced atomic layer deposition of copper: A comparison of precursors

Hagen, D.J., Connolly, J., Nagle, R., Povey, I.M., Rushworth, S., Carolan, P., Ma, P., Pemble, M.E.
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Volume:
230
Language:
english
Journal:
Surface and Coatings Technology
DOI:
10.1016/j.surfcoat.2013.06.066
Date:
September, 2013
File:
PDF, 3.32 MB
english, 2013
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