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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Thermal Characters Analysis of Induction-Self-Heating-Reflow for Solders Bumping
Xu, Hongbo, Li, Mingyu, Kim, Jongmyung, Kim, HongbaeYear:
2006
Language:
english
DOI:
10.1109/icept.2006.359776
File:
PDF, 4.95 MB
english, 2006