Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu...

Journal of The Electrochemical Society 2011 Vol. 158; Iss. 6

Thermal Atomic Layer Deposition (ALD) of Ru Films for Cu Direct Plating

Choi, Sang-Hyeok, Cheon, Taehoon, Kim, Soo-Hyun, Kang, Dae-Hwan, Park, Gye-Soon, Kim, Sunjung
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Volume:
158
Year:
2011
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.3575163
File:
PDF, 1.75 MB
english, 2011
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