[IEEE 2008 IEEE 9th VLSI Packaging Workshop of Japan - Kyoto, Japan (2008.12.1-2008.12.2)] 2008 IEEE 9th VLSI Packaging Workshop of Japan - Si interposers integrated with SrTiO3 thin film decoupling capacitors and through-Si-vias
Koichi Takemura,, Akira Ohuchi,, Akinobu Shibuya,Year:
2008
Language:
english
DOI:
10.1109/VPWJ.2008.4762231
File:
PDF, 3.04 MB
english, 2008