[IEEE Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Linz, Austria (2011.04.18-2011.04.20)] 2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - A study on thermal analysis for 3D heterogenous embedded system integration platform MorPACK
Jin-Ju Chue,, Yang, Chih-Chyau, Shih-Lun Chen,, Chun-Chieh Chiu,, Yi-Jun Liu,, Chun-Chieh Chu,, Wu, Chien-Ming, Huang, Chun-MingYear:
2011
Language:
english
DOI:
10.1109/ESIME.2011.5765819
File:
PDF, 921 KB
english, 2011