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[IEEE 2008 International Conference on Electronic Materials and Packaging (EMAP) - Taipei, Taiwan (2008.10.22-2008.10.24)] 2008 International Conference on Electronic Materials and Packaging - Fatigue strength of electroplated copper thin films under uni-axial stress
Murata, Naokazu, Tamakawa, Kinji, Suzuki, Ken, Miura, HideoYear:
2008
Language:
english
DOI:
10.1109/EMAP.2008.4784224
File:
PDF, 4.06 MB
english, 2008