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Microwave Characterization of a Wafer-Level Packaging Approach for RF MEMS Devices Using Glass Frit Bonding
Comart, Ilker, Topalli, Kagan, Demir, Simsek, Akin, TayfunVolume:
14
Language:
english
Journal:
IEEE Sensors Journal
DOI:
10.1109/JSEN.2014.2308256
Date:
June, 2014
File:
PDF, 3.53 MB
english, 2014