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[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - High frequency IC to IC signaling on rapidly prototyped flip chip MCM-D substrate
Reed, J.D., Caldwell, G., Wang, M., Hirsch, T., Yee, I., Lunceford, B., Somadder, A., Cobb, D., Miracky, R.F.Year:
1998
Language:
english
DOI:
10.1109/ICMCM.1998.670775
File:
PDF, 942 KB
english, 1998