A hermetic glass-silicon micropackage with high-density...

Journal of Microelectromechanical Systems 1996 / Sept. Vol. 5; Iss. 3

A hermetic glass-silicon micropackage with high-density on-chip feedthroughs for sensors and actuators

Ziaie, B., Von Arx, J.A., Dokmeci, M.R., Najafi, K.
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Volume:
5
Language:
english
Journal:
Journal of Microelectromechanical Systems
DOI:
10.1109/84.536623
Date:
January, 1996
File:
PDF, 2.88 MB
english, 1996
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