![](/img/cover-not-exists.png)
[ASME ASME/JSME 2011 8th Thermal Engineering Joint Conference - Honolulu, Hawaii, USA (March 13–17, 2011)] ASME/JSME 2011 8th Thermal Engineering Joint Conference - Effect of 1D Cu Nanostructures on Heat Transfer Characteristics of Single Phase Microchannel Heat Sink
Ali, M. Yakut, Yang, Fanghao, Fang, Ruixian, Li, Chen, Khan, JamilYear:
2011
Language:
english
DOI:
10.1115/AJTEC2011-44563
File:
PDF, 1.50 MB
english, 2011