The finite-element method for modeling circuits and interconnects for electronic packaging
Polycarpou, A.C., Tirkas, P.A., Balanis, C.A.Volume:
45
Language:
english
Journal:
IEEE Transactions on Microwave Theory and Techniques
DOI:
10.1109/22.641784
Date:
January, 1997
File:
PDF, 234 KB
english, 1997