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Optimized Programs for Shaped Conductive Backfill Material of Grounding Systems Based on the FDTD Simulations
Xiong, Run, Chen, Bin, Zhou, Bi-Hua, Gao, ChengVolume:
29
Language:
english
Journal:
IEEE Transactions on Power Delivery
DOI:
10.1109/TPWRD.2014.2298411
Date:
August, 2014
File:
PDF, 1.57 MB
english, 2014