Low-Temperature Bonding to 304 Stainless Steel for...

IEEE Transactions on Components Packaging and Manufacturing Technology 2011 / 04 Vol. 1; Iss. 4

Low-Temperature Bonding to 304 Stainless Steel for High-Temperature Electronic Packaging

Chu-Hsuan Sha,, Lee, C C
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Volume:
1
Language:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/TCPMT.2011.2106211
Date:
April, 2011
File:
PDF, 922 KB
english, 2011
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