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Thermal characterization of a bridge-link carbon nanotubes array used as a thermal adhesive
Rong, Hao, Lin, Wei-Qing, Zheng, Jin-Cheng, Lu, MiaoVolume:
49
Language:
english
Journal:
International Journal of Adhesion and Adhesives
DOI:
10.1016/j.ijadhadh.2013.12.006
Date:
March, 2014
File:
PDF, 2.30 MB
english, 2014