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[IEEE 2006 7th International Conference on Electronic Packaging Technology - Shanghai, China (2006.08.26-2006.08.29)] 2006 7th International Conference on Electronic Packaging Technology - Research on Micro Crack Induced during the Process of Assembling BGA
Pan, Kailin, Yan, Yilin, Zhou, Bin, Tsai, Bruce, Wu, ZhiqiangYear:
2006
Language:
english
DOI:
10.1109/ICEPT.2006.359787
File:
PDF, 5.32 MB
english, 2006