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Advances in Multifunctional Materials and Systems II (Ceramic Transactions, Volume 245) || Formation of Tough Foundation Layer for Electrical Plating on Insulator using Aerosol Deposition Method of Cu-Al 2 O 3 Mixed Powder
Akedo, Jun, Tseng, Tseung-Yuen, Chen, Xiang Ming, Lin, Hua-TayVolume:
10.1002/97
Year:
2014
Language:
english
DOI:
10.1002/9781118771402.ch2
File:
PDF, 366 KB
english, 2014