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[IEEE 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Taipei, Taiwan (2013.10.22-2013.10.25)] 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) - Thin wafer handling and chip to wafer stacking technologies
Pauzenberger, Gunter, Uhrmann, Thomas, Wimplinger, Markus, Matthias, Thorsten, Su, Kevin, Tsai, TseMinYear:
2013
Language:
english
DOI:
10.1109/IMPACT.2013.6706632
File:
PDF, 702 KB
english, 2013