Effect of H[sub 2] addition on surface reactions during CF[sub 4]/H[sub 2] plasma etching of silicon and silicon dioxide films
Marra, Denise C.Volume:
15
Language:
english
Journal:
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films
DOI:
10.1116/1.580762
Date:
September, 1997
File:
PDF, 520 KB
english, 1997