Ti–Al–Si–N films for superhard coatings deposited by reactive cosputtering using Ti, Al, and Si targets
A. Miyamura, M. Yamaguchi, K. Hattori, Y. Sato, S. Nakamura, Y. ShigesatoVolume:
25
Year:
2007
Language:
english
DOI:
10.1116/1.2721577
File:
PDF, 665 KB
english, 2007