The Relation Between Molecular Packing or Morphology and Chemical Structure or Processing Conditions: the Effect on Electronic Properties
Kumar, Pramod, Shivananda, Kammasandra Nanajunda, Zajączkowski, Wojciech, Pisula, Wojciech, Eichen, Yoav, Tessler, NirVolume:
24
Language:
english
Journal:
Advanced Functional Materials
DOI:
10.1002/adfm.201303571
Date:
May, 2014
File:
PDF, 1.48 MB
english, 2014