The orientation relationships of the Cu3Sn/Cu interfaces...

Thin Solid Films 2014 / 07 Vol. 562

The orientation relationships of the Cu3Sn/Cu interfaces and a discussion of the formation sequence of Cu3Sn and Cu6Sn5

Wang, Kuang-Kuo, Gan, Dershin, Hsieh, Ker-Chang
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Volume:
562
Language:
english
Journal:
Thin Solid Films
DOI:
10.1016/j.tsf.2014.05.003
Date:
July, 2014
File:
PDF, 729 KB
english, 2014
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