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[IEEE International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Irvine, California, USA (March 16-18, 2005)] Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005. - Electrodeposition of polyurethane adhesive for MEMS application
Yuli Wang,, Bachman, M., Guann-Pyng Li,Year:
2005
Language:
english
DOI:
10.1109/ISAPM.2005.1432052
File:
PDF, 2.66 MB
english, 2005