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[IEEE 2013 International Conference on IC Design & Technology (ICICDT) - Pavia, Italy (2013.05.29-2013.05.31)] Proceedings of 2013 International Conference on IC Design & Technology (ICICDT) - High-density capacitors for SiP and SoC applications based on three-dimensional integrated metal-isolator-metal structures
Weinreich, Wenke, Rudolph, Matthias, Koch, Johannes, Paul, Jan, Seidel, Konrad, Riedel, Stefan, Sundqvist, Jonas, Steidel, Katja, Gutsch, Manuela, Beyer, Volkhard, Hohle, ChristophYear:
2013
Language:
english
DOI:
10.1109/ICICDT.2013.6563342
File:
PDF, 2.74 MB
english, 2013