Impact of Gaseous Additives on Copper CMP in Neutral and...

Journal of The Electrochemical Society 2005 Vol. 152; Iss. 11

Impact of Gaseous Additives on Copper CMP in Neutral and Alkaline Solutions Using a CAP System

DeNardis, Darren, Doi, Toshiro, Hiskey, Brent, Ichikawa, Koichiro, Ichikawa, Daizo, Philipossian, Ara
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Volume:
152
Year:
2005
Language:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.2042908
File:
PDF, 587 KB
english, 2005
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