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[IEEE 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Shanghai, China (2010.11.1-2010.11.4)] 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology - Multiple Ti/Al stacks induced thermal stability enhancement in Ti/Al/Ni/Au Ohmic contact on AlGaN/GaN heterostructure
Dong, Zhihua, Wang, Jinyan, Gong, Rumin, Liu, Shenghou, Wen, C. P., Yu, Min, Xu, Fujun, Hao, Yilong, Shen, Bo, Wang, YangyuanYear:
2010
Language:
english
DOI:
10.1109/ICSICT.2010.5667648
File:
PDF, 500 KB
english, 2010