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Ultrasonic Friction Power in Microelectronic Wire Bonding
Mayer, Michael, Zwart, AndrewVolume:
539-543
Year:
2007
Language:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/MSF.539-543.3920
File:
PDF, 1.33 MB
english, 2007