Simulation and measurement of the flip chip solder bumps...

Microelectronics Reliability 2014 / 06 Vol. 54; Iss. 6-7

Simulation and measurement of the flip chip solder bumps with a Cu-plated plastic core

Weide-Zaage, K., Schlobohm, J., Rongen, R.T.H., Voogt, F.C., Roucou, R.
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Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.02.021
Date:
June, 2014
File:
PDF, 3.48 MB
english, 2014
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