Pad roughness evolution during break-in and its abrasion...

Microelectronic Engineering 2013 / 11 Vol. 111

Pad roughness evolution during break-in and its abrasion due to the pad-wafer contact in oxide CMP

Vasilev, Boris, Bott, Sascha, Rzehak, Roland, Bartha, Johann W.
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Volume:
111
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2013.04.027
Date:
November, 2013
File:
PDF, 2.42 MB
english, 2013
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