Impulse pressuring diffusion bonding of a copper alloy to a stainless steel with/without a pure nickel interlayer
Yuan, Xinjian, Tang, Kunlun, Deng, Yongqiang, Luo, Jun, Sheng, GuangminVolume:
52
Language:
english
Journal:
Materials & Design
DOI:
10.1016/j.matdes.2013.05.057
Date:
December, 2013
File:
PDF, 3.49 MB
english, 2013