Time–frequency analysis for ultrasonic measurement of liquid-layer thickness
Jiao, Jingpin, Liu, Wenhua, Zhang, Jie, Zhang, Qiang, He, Cunfu, Wu, BinVolume:
35
Language:
english
Journal:
Mechanical Systems and Signal Processing
DOI:
10.1016/j.ymssp.2012.08.015
Date:
February, 2013
File:
PDF, 1.03 MB
english, 2013