A molecular dynamics investigation into the mechanisms of subsurface damage and material removal of monocrystalline copper subjected to nanoscale high speed grinding
Li, Jia, Fang, Qihong, Liu, Youwen, Zhang, LiangchiVolume:
303
Language:
english
Journal:
Applied Surface Science
DOI:
10.1016/j.apsusc.2014.02.178
Date:
June, 2014
File:
PDF, 6.96 MB
english, 2014