Hybrid gold–copper stamp for rapid fabrication of microchips
Červenka, Petr, Schrott, Walter, Slouka, Zdeněk, Přibyl, Michal, Šnita, DalimilVolume:
98
Language:
english
Journal:
Microelectronic Engineering
DOI:
10.1016/j.mee.2012.07.030
Date:
October, 2012
File:
PDF, 623 KB
english, 2012