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The coupling effects of temperature, electric current and stress on the adhesion and electrical properties of COG assembly
Gao, Hong, Zhang, Dong, Gao, Lilan, Ma, Jian-huaVolume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2014.03.019
Date:
August, 2014
File:
PDF, 3.98 MB
english, 2014