Interfacial reactions of Sn–58Bi and Sn–0.7Cu lead-free...

Microelectronics Reliability 2014 / 1 Vol. 54; Iss. 1

Interfacial reactions of Sn–58Bi and Sn–0.7Cu lead-free solders with Alloy 42 substrate

Yen, Yee-Wen, Syu, Ruo-Syun, Chen, Chih-Ming, Jao, Chien-Chung, Chen, Guan-Da
How much do you like this book?
What’s the quality of the file?
Download the book for quality assessment
What’s the quality of the downloaded files?
Volume:
54
Language:
english
Journal:
Microelectronics Reliability
DOI:
10.1016/j.microrel.2013.09.003
Date:
January, 2014
File:
PDF, 1.98 MB
english, 2014
Conversion to is in progress
Conversion to is failed